Książka

SAMWIN

https://www.samwinsemi.com/products/s3af-s3mf.html

"FEATURES
For surface mounted applications

Low profile package

Glass Passivated Chip Junction

Easy to pick and place

Lead free in comply with EU RoHS 2011/65/EU directives



MECHANICAL DATA
Case: SMAF

Terminals: Solderable per MIL-STD-750, Method 2026

Approx.Weight: 27mg/0.00095oz."
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