Książka

SAMWIN

https://www.samwinsemi.com/products/s2aw-s2mw.html
"FEATURES
For surface mounted applications

Low profile package

Glass Passivated Chip Junction

ldeal for automated placement

Lead free in comply with EU RoHS 2011/65/EU directives



MECHANICAL DATA
Case: SOD.123FL

Terminals: Solderable per MlL-STD-750, Method 2026

Approx. Weight: 15mg 0.0053oz."
Momencik, trwa przetwarzanie danych   loading-animation